IPC HDBK-850 Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly standard by Association Connecting Electronics Industries, 07/01/2012
IPC 4552 Amendment 1 Amendment 1 to Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Amendment by Association Connecting Electronics Industries, 06/01/2012
IPC A-620AS Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A Requirements and Acceptance for Cable and Wire Harness Assemblies Amendment by Association Connecting Electronics Industries, 06/01/2012
IPC 4921 Requirements for Printed Electronics Base Materials (Substrates) standard by Association Connecting Electronics Industries, 06/01/2012
IPC 4204A Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry standard by Association Connecting Electronics Industries, 05/31/2012
IPC 2581 Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology standard by Association Connecting Electronics Industries, 05/01/2012
IPC J-STD-004B-WAM1 Requirements for Soldering Fluxes standard by Association Connecting Electronics Industries, 02/28/2012
IPC HDBK-001E Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B Handbook / Manual / Guide by Association Connecting Electronics Industries, 02/01/2012
IPC AJ-820A Assembly & Joining Handbook Handbook / Manual / Guide by Association Connecting Electronics Industries, 02/01/2012
IPC J-STD-033C Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007) standard by Association Connecting Electronics Industries, 02/01/2012
IPC J-STD-005A Requirements for Soldering Pastes standard by Association Connecting Electronics Industries, 02/01/2012
IPC 6018B Microwave End Product Board Inspection and Test standard by Association Connecting Electronics Industries, 11/01/2011