IPC 2223C Sectional Design Standard for Flexible Printed Boards standard by Association Connecting Electronics Industries, 11/01/2011
IPC 7525B Stencil Design Guidelines standard by Association Connecting Electronics Industries, 10/01/2011
IPC 9202 Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance standard by Association Connecting Electronics Industries, 10/01/2011
IPC T-50J Terms and Definitions for Interconnecting and Packaging Electronic Circuits standard by Association Connecting Electronics Industries, 10/01/2011
IPC 9707 Spherical Bend Test Method for Characterization of Board Level Interconnects standard by Association Connecting Electronics Industries, 09/01/2011
IPC CH-65B Guidelines for Cleaning of Printed Boards and Assemblies Handbook / Manual / Guide by Association Connecting Electronics Industries, 07/01/2011
IPC 7093 Design and Assembly Process Implementation for Bottom Termination Components standard by Association Connecting Electronics Industries, 03/28/2011
IPC DRM-18J Component Identification Training and Reference Guide standard by Association Connecting Electronics Industries, 03/01/2011
IPC SM-840E Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Materials standard by Association Connecting Electronics Industries, 12/01/2010
IPC 1071 Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing standard by Association Connecting Electronics Industries, 12/01/2010
IPC 9708 Test Methods for Characterization of Printed Board Assembly Pad Cratering standard by Association Connecting Electronics Industries, 12/01/2010
IPC 9631 User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation standard by Association Connecting Electronics Industries, 12/01/2010