IPC J-STD-033C-1 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices standard by Association Connecting Electronics Industries, 08/01/2014
IPC J-STD-003C-WAM1 Solderability Tests for Printed Boards with Amendment 1 standard by Association Connecting Electronics Industries, 05/01/2014
IPC 4101D Specification for Base Materials for Rigid and Multilayer Printed Boards standard by Association Connecting Electronics Industries, 04/01/2014
IPC 4103A-WAM1 Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1 standard by Association Connecting Electronics Industries, 01/01/2014
IPC 9709 Test Guidelines for Acoustic Emission Measurement during Mechanical Testing standard by Association Connecting Electronics Industries, 11/01/2013
IPC 2581B Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology standard by Association Connecting Electronics Industries, 09/01/2013
IPC A-630 Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures standard by Association Connecting Electronics Industries, 09/01/2013
IPC HDBK-830A Guidelines for Design, Selection and Application of Conformal Coatings Handbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/2013
IPC J-STD-006C Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications standard by Association Connecting Electronics Industries, 07/01/2013
IPC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires standard by Association Connecting Electronics Industries, 06/01/2013
IPC 9641 High Temperature Printed Board Flatness Guideline standard by Association Connecting Electronics Industries, 06/01/2013
IPC 4412B Specification for Finished Fabric Woven from "E" Glass for Printed Boards standard by Association Connecting Electronics Industries, 05/01/2013