IPC TR-581 IPC Phase 3 Controlled Atmosphere Soldering Study standard by Association Connecting Electronics Industries, 08/01/1994
IPC ML-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards standard by Association Connecting Electronics Industries, 07/01/1994
IPC DR-570A General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards standard by Association Connecting Electronics Industries, 04/01/1994
IPC CI-408 Solderless Surface Mount Connectors Design Characteristics and Application Guidelines Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1994
Composite Metallic Material Specification for Printed Wiring Boards Book by Association Connecting Electronics Industries, 01/01/1994
IPC OI-645 Standard for Visual Optical Inspection Aids standard by Association Connecting Electronics Industries, 10/01/1993
IPC MS-810 Guidelines for High Volume Microsection standard by Association Connecting Electronics Industries, 10/01/1993
IPC S-816 SMT Process Guideline and Checklist standard by Association Connecting Electronics Industries, 07/01/1993
IPC TR-465-2 The Effect of Steam Aging Time and Temperature on Solderability Test Results standard by Association Connecting Electronics Industries, 01/01/1993
IPC SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments standard by Association Connecting Electronics Industries, 11/01/1992
IPC TP-104-K Cleaning & Cleanliness Test Program, Phase 3, Water Soluble Fluxes Parts 1 and 2 Report / Survey by Association Connecting Electronics Industries, 10/01/1992
IPC FC-232C [ Withdrawn ] Specification for Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring standard by Association Connecting Electronics Industries, 08/01/1992