IPC DD-135 Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules standard by Association Connecting Electronics Industries, 08/01/1995
IPC 9501 PWB Assembly Process Simulation for Evaluation of Electronic Components standard by Association Connecting Electronics Industries, 07/10/1995
IPC DW-425A Design and End Product Requirements for Discrete Wiring Boards standard by Association Connecting Electronics Industries, 05/01/1995
IPC D-325A Documentation Requirements for Printed Boards standard by Association Connecting Electronics Industries, 05/01/1995
IPC TR-466 Technical Report: Wetting Balance Standard Weight Comparison Test standard by Association Connecting Electronics Industries, 04/01/1995
IPC J-STD-001B [ Withdrawn ] Requirements for Soldered Electrical and Electronic Assemblies standard by Association Connecting Electronics Industries, 01/01/1995
IPC J-STD-005 Requirements for Soldering Pastes, Includes Amendment 1 (2007) standard by Association Connecting Electronics Industries, 01/01/1995
IPC DW-424 General Specification for Encapsulated Discrete Wire Interconnection Boards standard by Association Connecting Electronics Industries, 01/01/1995
IPC CA-821 General Requirements for Thermally Conductive Adhesives standard by Association Connecting Electronics Industries, 01/01/1995
IPC D-355 Printed Board Automated Assembly Description in Digital Form standard by Association Connecting Electronics Industries, 01/01/1995
IPC A-610B [ Withdrawn ] Acceptability of Printed Board Assemblies - Incorporates Amendment 1 standard by Association Connecting Electronics Industries, 12/01/1994
IPC TR-582 Cleaning and Cleanliness Testing Program for: Phase - Low Solids Fluxes and Pastes Processed in Ambient Air standard by Association Connecting Electronics Industries, 11/01/1994