IPC 9503 Moisture Sensitivity Classification for Non-IC Components standard by Association Connecting Electronics Industries, 04/01/1999
IPC 9502 PWB Assembly Soldering Process Guideline for Electronic Components standard by Association Connecting Electronics Industries, 04/01/1999
IPC 4411 Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement standard by Association Connecting Electronics Industries, 04/01/1999
IPC EXPO-99 IPC Printed Circuits Expo 99 Proceedings standard by Association Connecting Electronics Industries, 03/01/1999
IPC 2524 PWB Fabrication Data Quality Rating System standard by Association Connecting Electronics Industries, 02/01/1999
IPC CH-65A Guidelines for Cleaning of Printed Boards and Assemblies Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1999
IPC FLEX-CO-99 IPC National Conference Flexible Circuits Volume I & II - Denver, CO 1999 Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999
IPC BET-99 National Conference on Bare Board and Advanced Substrate Electrical Test: HDI's Holy Grail Proceedings Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999
IPC TP-1115 Selection and Implementation Strategy for a Low-Residue, No-Clean Process standard by Association Connecting Electronics Industries, 12/01/1998
IPC EAE-98 Electronics Assembly Expo 1998 standard by Association Connecting Electronics Industries, 11/01/1998
Resin Coated Metal Foil for Printed Boards Book by Association Connecting Electronics Industries, 09/01/1998
IPC 4130 Specification and Characterization Methods for Nonwoven "E" Glass Materials standard by Association Connecting Electronics Industries, 09/01/1998