IPC A-610C Acceptability of Electronic Assemblies standard by Association Connecting Electronics Industries, 01/01/2000
IPC 6801 Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards standard by Association Connecting Electronics Industries, 01/01/2000
IPC TMRC-00T 2000 Technology Trends for Printed Wiring Boards Report / Survey by Association Connecting Electronics Industries, 01/01/2000
IPC A-600F [ Withdrawn ] Acceptability of Printed Boards standard by Association Connecting Electronics Industries, 11/01/1999
IPC 6202 Performance guide Manual for single- and double-sided flexible printed wiring boards standard by Association Connecting Electronics Industries, 10/01/1999
IPC 6012A-AM Qualification and Performance Specification for Rigid Printed Boards - Includes Amendment 1 standard by Association Connecting Electronics Industries, 10/01/1999
IPC 4104 Specifications for High Density Interconnect (HDI) and Microvia Materials standard by Association Connecting Electronics Industries, 05/01/1999
IPC J-STD-020A Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices standard by Association Connecting Electronics Industries, 04/01/1999
IPC 6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards standard by Association Connecting Electronics Industries, 05/01/1999
IPC J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components standard by Association Connecting Electronics Industries, 04/01/1999
IPC J-STD-028 Performance Standard fo Construction of Flip Chip and Chip Scale Bumps standard by Association Connecting Electronics Industries, 04/01/1999
IPC J-STD-026 Semiconductor Design Standard for Flip Chip Applications standard by Association Connecting Electronics Industries, 04/01/1999