Reduced price! View larger

IPC 4555

M00005960

New product

IPC 4555 Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards

standard by Association Connecting Electronics Industries, 04/01/2022

More details

In stock

$51.17

-57%

$119.00

More info

Full Description

This performance specification sets requirements for High Temperature Organic Solderability Preservatives (OSP-High Temperature) for Pb-free soldering. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM).