M00005972
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IPC 7525C Stencil Design Guidelines
standard by Association Connecting Electronics Industries, 11/01/2021
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Availability date: 03/03/2022
This document provides guidance for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only. Much of the content is based on the experience of stencil designers, fabricators, and users. Printing performance depends on many different variables and therefore no single set of design rules can be established. Although this Handbook uses mandatory terminology, e.g., shall, must, etc., nothing within this Handbook is considered mandatory unless this document is specified as a mandatory requirement in the contract documentation.