Full Description

This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.

Product Details

Published: 10/01/2011 Number of Pages: 36 File Size: 1 file , 2.1 MB