Full Description

This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but rather guides to assure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders.

Product Details

Published: 04/01/1999 Number of Pages: 12 File Size: 1 file , 210 KB Part of: IPC 9500-K, IPC M109 Product Code(s): 9502(D)1