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IPC 6016

M00005818

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IPC 6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards

standard by Association Connecting Electronics Industries, 05/01/1999

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Establishes the specific electrical, mechanical and environmental requirements for organic HDI layers with microvia technology. The acceptance criteria of the HDI layers are organized into specification sheets that reflect typical end-use applications, such as cellular phones, avionics, automotive and personal computers. For use with IPC-6011.