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SAE GEIA-STD 0006B:2019-04-01
New product
Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts
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This standard defines the requirements for fully replacing undesirable surface finishes using robotic hot solder dip. Requirements for qualifying and testing the refinished piece parts are also included. This standard covers the replacement of pure tin and Pb-free tin alloy finishes with SnPb finishes with the intent of subsequent assembly with SnPb solder. This dipping is different from dipping to within some distance of the body for the purposes of solderability; solder dipping for purposes other than full replacement of pure tin and other Pb-free tin alloy finishes are beyond the scope of this document. It covers process and testing requirements for robotic dipping process and does not cover semi-automatic or purely manual dipping processes.
| Author | SAE |
|---|---|
| Editor | SAE |
| Document type | Standard |
| Format | File |
| ICS | 25.160.50 : Brazing and soldering
31.020 : Electronic components in general |
| Number of pages | 20 |
| Replace | SAE GEIA-STD 0006A:2016-02-24 |
| Year | 2019 |
| Document history | SAE GEIA-STD 0006A:2016-02-24 |
| Country | USA |
| Keyword | SAE 0006;SAE GEIASTD0006B;SAE GEIASTD0006B;SAE GEIASTD 0006 |