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SAE ARP 6415:2019-07-23

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Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder

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This document contains information and guidance on the use of Pb-free ball grid arrays (BGAs) in an aerospace, defense, and high performance (ADHP) product, or other products which demand a high reliability.

Author SAE
Editor SAE
Document type Standard
Format File
Number of pages 32
Year 2019
Country USA
Keyword SAE 6415;SAE ARP6415;SAE ARP6415;SAE ARP 6415