ASTM Volume 10.04 - 2019 Print

Volume 10.04 covers standards on electronics, including:
• Innerlayer interconnections and bonding
• Materials and processes for vacuum tubes
• Electronic device characterization
• Hermetic seals
• Hybrid circuits and substrates
• Microelectronic packaging
• Leak testing
• And more
This volume also includes the latest standards relating to:
• Declarable substances in materials
• 3D imaging systems
• Additive manufacturing technologies