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JIS Z 3285:2017
New product
JIS Z 3285:2017
Solder paste for micro-joining - Characteristic test methods for solder paste using fine particlesMore info
This Standard specifies the characteristics test methods for solder paste using fine solder particles with a particle size of symbol 7 and symbol 8 specified in JIS Z 3284-1, mainly intended for connection of wiring and components to high-density printed circuit boards with fine wiring (e.g. 60 micrometre or smaller in minimum conductor width and minimum conductor spacing) used in electronic and communication devices.
| Author | JSA |
|---|---|
| Editor | JSA |
| Document type | Standard |
| Format | File |
| ICS | 25.160.50 : Brazing and soldering
|
| Number of pages | 30 |
| Year | 2017 |
| Document history | |
| Country | Japan |
| Keyword | JIS 3285;3285 |