IPC TR-486 Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations standard by Association Connecting Electronics Industries, 07/01/2001
IPC J-STD-001HS Requirements for Soldered Electrical and Electronic Assemblies Amendment by Association Connecting Electronics Industries,
IPC 2222B Sectional Design Standard for Rigid Organic Printed Boards standard by Association Connecting Electronics Industries, 10/01/2020
IPC 1782A Standard for Manufacturing and Supply Chain Traceability of Electronic Products standard by Association Connecting Electronics Industries, 11/01/2020
IPC 2551 International Standard for Digital Twins standard by Association Connecting Electronics Industries, 12/01/2020
IPC 2591-Version 1.2 Connected Factory Exchange (CFX) standard by Association Connecting Electronics Industries, 09/01/2020
IPC WP-019B White Paper on Global Change in Ionic Cleanliness Requirements standard by Association Connecting Electronics Industries, 09/01/2020
IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies standard by Association Connecting Electronics Industries, 09/01/2020
IPC A-610H Acceptability of Electronic Assemblies standard by Association Connecting Electronics Industries, 09/01/2020
IPC A-620DS Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620D Amendment by Association Connecting Electronics Industries, 08/01/2020
IPC TR 587 Conformal Coating Material and Application "State of the Industry" Assessment Report standard by Association Connecting Electronics Industries, 07/31/2020
IPC 9797 Press-fit Standard for Automotive Requirements and other High-Reliability Applications standard by Association Connecting Electronics Industries, 05/01/2020