IPC TR-485 Results of Copper Foil Rupture Strength Test Round Robin Study standard by Association Connecting Electronics Industries, 03/01/1985
IPC A-38 Fine Line Round Robin Test Pattern standard by Association Connecting Electronics Industries, 09/01/1984
IPC TR-578 Leading Edge Manufacturing Technology Report standard by Association Connecting Electronics Industries, 09/01/1984
IPC TR-460A Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards standard by Association Connecting Electronics Industries, 02/01/1984
IPC D-422 Design Guide for Press Fit Rigid Printed Board Backplanes Handbook / Manual / Guide by Association Connecting Electronics Industries, 09/01/1982
IPC TR-481 Results of Multilayer Test Program Round Robin standard by Association Connecting Electronics Industries, 04/01/1981
IPC TR-470 Thermal Characteristics of Multilayer Interconnection Boards standard by Association Connecting Electronics Industries, 01/01/1974
IPC TM-650 TM-650 - Test Methods Manual standard by Association Connecting Electronics Industries,
IPC A-24-G Surface Insulation Resistance - Gerber Format standard by Association Connecting Electronics Industries,
IPC A-25A-G Multipurpose 1 Sided Test Pattern - Gerber Format standard by Association Connecting Electronics Industries,
IPC A-25 Multipurpose 1 & 2 Sided Test Pattern standard by Association Connecting Electronics Industries,
IPC A-25-G Multipurpose 1 & 2 Sided Test Pattern - Gerber Format standard by Association Connecting Electronics Industries,